$99.00
The root cause of many EMC emission issues revolves around the circuit board design and how the I/O and power connectors are arranged and filtered. Poor board designs and poor interconnect placement and filtering can result in radiated emissions, radiated immunity, and electrostatic discharge (ESD) compliance failures, among others. Bad designs often result in endless cycles of trial and error mitigation, compliance testing and board spins. This drags out the schedule and is very costly. I’ll explain how digital signals propagate in boards as electromagnetic fields. I’ll also explain how interconnect placement and poor filtering design and layout can affect the EMI performance. I’ll also focus on methods for low-EMI power conversion – primarily with on-board DC-DC converters. However, the same principles described may also be used for higher-power designs. Once you understand the basics, then board stack- up, trace routing, filter design and interconnect placement should become very clear and you should be able to design a low-EMI board and power converter the first time!
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